Texture development and residual stress in UHV evaporated silver films on glass substrates as a function of substrate temperature

Pole figures were collected for silver films of 140 nm thickness deposited on glass substrates with deposition rate of 0.076 nm s(-1), for substrate temperatures between 300 and 600 K covering all three zones in the structure zone model (SZM), using an X-ray diffractometer in texture mode. Additional information for determination of residual stress in these films was obtained by the sin(2) psi technique. The components of the stress tensor were obtained using measurements at three different phi angles of 0 degrees, 45 degrees and 90 degrees. The crystallite sizes as a function of substrate temperature and phi angle were also obtained, and showed, an increase with substrate temperature in agreement with the SZM predictions, and a decrease with phi angle, possibly due to some correlation between the preferred orientation and grain size. The relation between stress in these films and the processes of film growth in the SZM is discussed. (c) 2004 Elsevier Ltd. All rights reserved.