Abstract
It is reported that a flat free surface of a stressed solid is configurationally unstable under chemical etching and the surface roughness grows with different rates for different spatial frequencies. The theory described in this Letter predicts that with a shallow chemical etching the roughness with spatial frequency below a critical value grows while the roughness of higher frequency decays. The theory was verified via an atomic force microscope experiment with aluminum. This study provides a simple experimental method to measure stress in metals and ceramics.
Original language | English |
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Pages (from-to) | 3872-3875 |
Number of pages | 4 |
Journal | Physical Review Letters |
Volume | 83 |
Issue number | 19 |
DOIs | |
Publication status | Published - 8 Nov 1999 |